薄膜被動元件製造 For Thin-film Passive Component Fabrication.

For Laboratory Use and Low Volume Production.

24x28in光罩玻璃顯影/蝕刻/去光阻/清洗製程，應用於高密度印刷電路板(HDI)製造。 For 24x28-inch Chrome Mask Developing/Etching/Stripping/Cleaning in HDI PCB Processes.

適合實驗室與小批量生產

For Laboratory Use and Low Volume Production Coating Applications.

24x28in光罩玻璃顯影/蝕刻/去光阻/清洗製程，應用於高密度印刷電路板(HDI)製造。 For 24x28-inch Chrome Mask Developing/Etching/Stripping/Cleaning in HDI PCB Processes.

550x670mm玻璃基板顯影製程，應用於大尺寸觸控金屬網格(Metal Mesh)製造。 For 550x670mm Glass Substrate Developing in Large-sized Touch-panel Metal Mesh Fabrication Processes.

針對玻璃與金屬材質的外觀性產品，包含建築玻璃帷幕、3C觸控產品、飾品、模具、太陽能板鋁框、鋁窗等，提供具備防汙、抗指紋、易潔、耐候功能的塗層。

一般Spin Coating塗料利用率2-5%; Slit-spin Coating塗料利用率可提升至>70%，適用於大尺寸基板塗佈與高價值塗料塗佈應用。 Slit-spin coater enables high material utilization of above 70% compared to spin coating of around 2-5%, suitable for coating of large-sized substrate and high cost materials.

提供Metal Mesh與光學轉印精微模具的厚膜光阻塗佈製程 Providing thick-film photo resist coating process in metal mesh and optical precision molding applications.

一般Spin Coating塗料利用率2-5%; Slit-spin Coating塗料利用率可提升至>70%，適用於大尺寸基板塗佈與高價值塗料塗佈應用。 Slit-spin coater enables high material utilization of above 70% compared to spin coating of around 2-5%, suitable for coating of large-sized substrate and high cost materials.

有機薄膜電晶體顯影製程 For Organic Thin Film Transistors (OTFT) Developing Process.

陶瓷基板光阻細線路顯影製程 For Ceramic Substrate Photo Resist Fine-line Developing Process.

自動鋁/金線蝕刻，應用於IC封裝打線失效分析。 For auto Al/Au wire etching in IC package failure analysis.

國立台灣大學卓越研究大樓新建無塵室-酸/鹼/有機晶片清洗台。 National Taiwan University Outstanding Reserach Building New Built Clean-room - Acid/Alkali/Organic Wet Benches.